About the role
AI summarisedAs a Senior Manager of Package Design/Development Quality Assurance at Micron, you will lead a specialized engineering team focused on ensuring the reliability and successful introduction of advanced package technologies. You will drive technical strategy for chip-package interaction risks, lead failure analysis and mitigation efforts, mentor engineers, and influence Micron's package technology roadmap through data-driven decisions and cross-functional leadership. This role combines deep technical expertise in packaging reliability with people management and operational excellence to deliver both immediate quality outcomes and long-term technology impact.
IDMOnsiteQuality
Key Responsibilities
- Lead DDQA strategy for new package technology introductions, with focus on CPI and customer integration risks
- Drive early identification and mitigation of package-level reliability and interaction risks
- Define and oversee characterization and reliability test strategies
- Ensure effective root cause analysis and closure of package technology quality issues
- Drive systematic capture and reuse of lessons learned in next-generation technologies
- Act as a technical escalation point for package-related customer quality and integration issues
- Lead, mentor, and develop a highly technical DDQA engineering team
- Set clear expectations, performance goals, and development plans for direct reports
- Build technical depth, engagement, and succession within the organization
- Foster a culture of accountability, collaboration, and technical excellence
- Drive internal and external technical publications related to package reliability and CPI
Requirements
- 10+ years of experience in Packaging Technology, Assembly Engineering, Product Quality and Reliability Engineering, and/or Failure Analysis
- Demonstrated ability to lead and develop senior technical engineers
- Strong knowledge of semiconductor package assembly and surface-mount processes
- Solid understanding of thermomechanical, thermal, mechanical, and hygroscopic stress effects on package reliability
- Working knowledge of industry reliability test methods, acceleration models, and sampling statistics
- Experience applying FMEA and structured problem-solving methodologies (e.g., 8D)
- Strong analytical skills with the ability to translate complex data into clear technical decisions
- Proven ability to collaborate across functions and influence outcomes in complex technical environments