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Micron Technology

Director, AT Capital and Advanced Packaging Cost

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 1 month ago
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About the role

AI summarised

The Director of AT Capital and Advanced Packaging Cost leads strategic initiatives to optimize capital efficiency and cost performance for Micron's Advanced Packaging and Conventional Packaging roadmaps. This role oversees capital planning, cost benchmarking, and cross-functional collaboration to drive ROI and support high-volume manufacturing targets. The position requires strong leadership, financial acumen, and the ability to influence senior stakeholders across global teams.

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Key Responsibilities

  • Oversee the full AT Capital Roll-Up process and ensure accuracy, transparency, and alignment with business objectives
  • Establish standardized processes for Capital Requests, including NPV justification methodologies
  • Lead Capital Plan Optimization, Budget Planning, Funding Allocation, and Cash Flow Management to maximize ROI
  • Manage HBM and Advanced Packaging excess, reuse opportunities, and asset transfer strategies
  • Develop internal and external cost benchmarking programs to enhance the competitiveness of Micron's Advanced Packaging portfolio
  • Lead Cost Workshops for new node MOR introductions and ensure alignment against CoT (Cost of Transition) targets defined within EPP (Establish Program Plan) reviews
  • Drive cross-functional Cost Reduction initiatives with PDE, Central IE, Site IE/Cost Teams, and APE—including analysis of loading plans, capacity, capital deployment, risks, and improvement opportunities
  • Partner closely with Finance to refine TD and NPI cost charge structures
  • Define and implement scalable business processes and modeling systems that enable consistent capital and cost planning excellence
  • Lead and develop two core teams: AT Capital Team and Advanced Packaging Cost Team

Requirements

  • Bachelor's degree in Engineering, Information Systems, Computer Science, or related field; or equivalent industrial engineering experience
  • Minimum of 10 years of experience in the semiconductor industry
  • Demonstrated excellence in leading and mentoring high-performance teams
  • Strong communication skills, with the ability to influence stakeholders across all organizational levels
  • Proven project management expertise with the ability to drive complex, cross-functional programs
  • Strong analytical, interpersonal, and decision-making skills, with the ability to thrive in a dynamic environment
  • Practical knowledge of statistics, data analysis, and structured problem-solving
  • A track record of outstanding performance and leadership capability in prior roles