Jobfoundry
Jobfoundry
Micron Technology

STAFF ENGINEER FE GLOBAL WAFER LOGISTIC AUTOMATION

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time1 months ago
Apply Now

About the role

AI summarised

Staff Engineer role in Micron's Global Wafer Logistic Automation team, focusing on automated packaging solutions for wafer logistics in semiconductor manufacturing. Responsibilities include technical ownership of mechanized packaging systems, process improvement, global standardization, and cross-functional collaboration.

IDMFull-timeFront End

Key Responsibilities

  • Provide technical ownership and engineering support for mechanised packaging solutions, including FOSB and HWS/BHWS Auto Packer, Auto Unpacker, and Auto Packer and Unpacker for Hybox applications.
  • Provide support and advance HWS (Horizontal Wafer Shipper) packing operations, covering process definition, validation, and sustained improvement.
  • Promote worldwide consistency in equipment specifications, process flows, and operating procedures for semiconductor packaging and shipping.
  • Partner with equipment suppliers to define requirements, review builds, support FAC/SAC, and resolve technical and operational issues.
  • Assist new fab wafer logistic automation rollouts by conducting layout reviews, evaluating capacity, and coordinating deployment efforts.
  • Analyse equipment and process performance data to identify improvement opportunities in efficiency, reliability, ergonomics, and safety.
  • Collaborate with AMHS, warehouse operations, EHS, quality, and IT teams to ensure compliance with Micron policies and standards.
  • Develop and maintain engineering documentation, specifications, and standard process guidelines.
  • Provide technical mentorship and training to site engineers and operations teams.
  • Support technology roadmaps and future automation initiatives related to wafer packaging and logistics.

Requirements

  • Bachelor's degree in Mechanical Engineering, Electrical Engineering, Mechatronics, Automation Engineering, or a related field.
  • 7+ years of engineering experience in semiconductor manufacturing, warehouse automation, or wafer logistics.
  • Hands‑on experience with FOSB and HWS Auto Packer / Auto Unpacker / Hybox Auto Packer/Unpacker systems, preferably supporting FOSB, HWS, Hybox or equivalent wafer shipping containers.
  • Demonstrated expertise in automated packaging systems and semiconductor logistics.
  • Solid technical knowledge in equipment specification, process flow, and operating procedures.
  • Working knowledge of HWS (Horizontal Wafer Shipper) packing processes.
  • Outstanding analytical skills to determine and successfully implement process improvements.
  • Ability to collaborate effectively across global, cross‑functional teams.
  • Excellent written and verbal communication skills, with the ability to deliver clear technical guidance and mentorship.
  • Experience supporting multi‑site or global deployments of automated packaging or warehouse systems is advantageous.
  • Familiarity with AMHS, ASRS, or automated warehouse environments is advantageous.
  • Experience working directly with equipment vendors throughout the equipment lifecycle is advantageous.
  • Knowledge of semiconductor EHS, ergonomics, and cleanroom requirements is advantageous.
  • Willingness to travel domestically and internationally as required.