Micron Technology

Engineer, Product & System Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 3 months ago

About the role

AI summarised

The Engineer, Product & System Engineering (Media Health Reliability) role focuses on developing and executing reliability test strategies for Micron's High Bandwidth Memory (HBM) products. Responsibilities include driving extrinsic and intrinsic DPM reduction, leading qualification efforts, performing root cause analysis on qual and RMA failures, supporting frontend process conversions, and collaborating across Fab, TD, GQ, and design teams to improve yield, quality, and cycle time. The role also emphasizes innovation, project management, and cross-functional alignment to ensure robust product development and manufacturing readiness.

IDMOnsiteHIG

Key Responsibilities

  • Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects
  • Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution
  • Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time
  • Debug and identify root cause and failures in reliability tests by electric failure analysis (EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration
  • Provide recommendation to fab teams for new process conversions to reduce cost, increase yields
  • Communicate with Product Managers/Leads to manage risks associated with DPM process conversions
  • Promote innovation and drive for changes that will provide Micron with a technical advantage over its competition
  • Make final decisions on risk analysis and project prioritization
  • Collaborate with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team

Requirements

  • Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field
  • Coursework or internship experience in semiconductor devices, circuit design, or product validation is a plus
  • Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces
  • Familiarity with CMOS technology, DRAM architecture, and basic device physics
  • Exposure to data analysis, statistics, and scripting tools such as Python or JMP
  • Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment
  • Clear and effective communication skills in written and spoken, especially when articulating technical concepts and findings