Jobfoundry
Jobfoundry
A*STAR

Research Engineer /Senior Research Engineer - Process Integrator / Hybrid Bonding/ HI

A*STAR
ResearchSingaporeFull-time3 weeks ago
Apply Now

About the role

AI summarised

Research Engineer/Senior Research Engineer role at the Institute of Microelectronics (IME) focusing on advanced chip-to-wafer and wafer-to-wafer hybrid bonding processes for 2.5D and 3D packaging applications. The position involves developing fabrication techniques, conducting electrical and reliability characterization, and collaborating with a research team and external stakeholders.

ResearchFull-timeInstitute of Microelectronics

Key Responsibilities

  • Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
  • Interposer and Hybrid Bond pad fabrication for Flip Chip and Hybrid bonding applications
  • Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
  • Conduct engineering experiments for process characterization to drive quality and yield improvements.
  • Perform reliability characterization of flip-chip or hybrid-bonded packages to ensure robustness and long-term performance.
  • Lead capability development projects with manageable risks and mentor less experienced colleagues.
  • Collaborate with senior staff and principal investigators to develop process capability and new.
  • Inspire and mentor talent in semiconductor technology, contributing to workforce development in the field.

Requirements

  • Bachelors in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
  • 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogenous integration applications.
  • Hands-on experience in flip chip bonding is preferable
  • Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory.
  • Strong analytical and problem-solving skills.
  • Proficiency in data analysis and interpretation and design of experiments.
  • Excellent written and verbal communication abilities.
  • Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders).
  • Demonstrated ability to manage multiple tasks and projects simultaneously.
  • Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.