About the role
AI summarisedThis internship focuses on Physical Failure Analysis (PFA) methodologies for advanced 3D-NAND flash memory devices. The intern will study historical PFA case studies and analysis workflows to understand how technical factors influence complexity, sequencing, and cycle time variability under professional supervision.
IDMOnsiteFront End
Key Responsibilities
- Review and study historical, de-identified PFA case studies and analysis workflows
- Analyze how different technical factors influence PFA analysis complexity
- Investigate factors affecting cycle time variability in failure analysis
- Learn how analytical steps are sequenced within PFA workflows
- Evaluate analysis efficiency from a technical perspective
Requirements
- Enrollment in a relevant academic program as a student
- Interest in Physical Failure Analysis (PFA) and semiconductor device physics
- Ability to participate in a learning-focused technical study of 3D-NAND technologies
- Analytical mindset to evaluate complex engineering workflows
- Willingness to work under close supervision in a technical environment