About the role

AI summarised

Process Development Engineer (R&D) at Apple, responsible for developing new processes and materials for next-generation module technologies. The role involves conducting feasibility studies, proof-of-concept experiments, and defining quality metrics for camera and laser projector modules in a semiconductor/electronics manufacturing environment.

TechnologyFull-timeHardware

Key Responsibilities

Conduct feasibility studies, develop new process and material development for new module technologies under research and development.
Establish new baseline processes by conducting proof of concept (POC) studies and Design of Experiments (DOEs).
Define Critical-To-Quality (CTQ) metrics, their specifications and the necessary metrology tools/procedures required to measure these CTQs.
Develop new process equipments with the support from external vendors.
Prepare and present engineering reports to cross-functional teams.

Requirements

Degree of Science in Engineering or equivalent.
Minimum 2 to 3 years of experience in doing process R&D.
Clear and effective written and communication skills.
Hands-on experience in various module assembly processes such as flip chip, flex attach, pick and place, glue dispensing, wire bonding, filling, laser soldering, component cleaning, curing, plating, singulation, wafer bonding.
Good knowledge and hands-on experience in camera or laser projector module assembly processes with high placement accuracy requirements, such as lens and VCSEL attach.
Good knowledge in design of experiment (DOE), engineering statistic, root cause analysis and problem solving.
Familiarity on different metrology tools and quantitative measurement methodology.
Knowledge of statistical analysis software (e.g. JMP or Minitab).
Resourceful and innovative.
Knowledge and work experience in one or more of the following processes & handling such processes equipment: Flip Chip bonding (Thermosonic, Thermocompression, etc.), EVO die bonder or any Pick & Place equipment platform, Wirebond/Studbump, Flex Attach (Flexible Printed Circuit Board Bonding), Glue / Solder Paste Dispensing, Solder Jetting/Laser Wire Soldering, SMT (e.g. solder printing, component pick&place, AOI, SPI and reflow), Wire cutting & crimping.
Knowledge on adhesive or epoxy or other bonding material.
Experience in optical components, active alignment and high accuracy bonding process.