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Micron Technology

Principal / Senior/ Engineer, Package Characterization - APTD

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time4 months ago
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About the role

AI summarised

This is a senior-level Advanced Packaging Characterization Engineer role at Micron Technology, within the Advanced Packaging Technology Development (APTD) group. The engineer will provide package development characterization and failure analysis support, establish analysis methods, and collaborate with cross-functional teams to resolve failures. The role requires expertise in failure analysis methodologies and hands-on proficiency with analytical tools like SEM, FIB, TEM, and X-ray.

IDMFull-timeHIG

Key Responsibilities

  • Understand PFA techniques available for de-processing failures
  • Understand assembly and test process
  • Perform electrical verification to confirm failures
  • Establish best known method for de-processing package
  • Understand backend test flows, qualification methodologies and be able to pull relevant information
  • Document failure analysis techniques used to isolate failure for other groups
  • Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA
  • Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs
  • Conduct TMO training and FA certification
  • Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning
  • Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network
  • Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap

Requirements

  • PhD, Master's, or Bachelor's degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline
  • 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques
  • Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques
  • Strong communication skills with the ability to collaborate effectively across internal teams and external partners
  • A mindset that emphasizes customer focus, continuous improvement, and striving for excellence