About the role
AI summarisedSenior/Staff Equipment Development Engineer at Micron, a semiconductor memory and storage company, responsible for developing and optimizing advanced packaging equipment for wafer-level packaging and stacking. The role involves improving equipment capability, establishing hardware roadmaps, and collaborating with cross-functional teams to integrate manufacturing processes.
IDMFull-timeHIG
Key Responsibilities
- Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking
- Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity
- Establish and improve equipment management projects to deliver tech node requirements
- Evaluate and promote new equipment and materials to enhance process capabilities
- Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing
- Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron's products, cost, availability, and improve hardware and process capability
- Ensure defense coverage through process, measurement, inspection, and testing
- Establish correlations between defense mechanisms to identify improvement opportunities
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities with SMAI team
- Develop hardware roadmaps for 5+ years in post probe wafer and die processing process area
- Collaborating with process development teams to develop innovative new solutions
- Performing fundamental research to drive innovative solutions for next-generation equipment products
Requirements
- B.S./M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 5 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field stacking process equipment TC bonder/Hybrid Bonder
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred
- Experience with Visual Basic for automation and tool integration
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
- Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware
- Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure
- Knowledge of semiconductor processing, solid-state device physics desirable
- Consistent track record to solve problems and address root causes