About the role
AI summarisedEngineering Execution Manager for High Bandwidth Memory (HBM) product development at Micron Technology, a semiconductor memory leader. Responsible for guiding HBM products from concept to high-volume manufacturing, managing cross-functional teams, schedules, and risks.
IDMFull-timeHIG
Key Responsibilities
- Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations.
- Partner with the Technology Development, Design, Process, APTD, PE and Manufacturing teams to drive development progress and alignment.
- Collaborate with PMO org to build and maintain detailed development schedule and drive relevant tactical execution starting from pre-silicon to all the way to HVM.
- Provide regular communication of development status, priorities, and challenges across the broader organization.
- Set and prioritize tactical expectations across development activities, according to defined milestones and stakeholder needs and expectations.
- Serve as a point of contact for the product, including identifying owners for tasks and issues that require coverage and managing development documentation.
- Consolidate and provide the inputs for hardware readiness and capacity planning required to support engineering activities.
Requirements
- Bachelor's or Master's degree in Electrical or Computer Engineering or manufacturing/supply chain related fields.
- 5+ years of relevant technical, manufacturing or experience in driving cross functional teams.
- Excellent Communication/Presentation skills.
- Excellent written and verbal communication skills for technical and senior management audiences.
- Comfortable with data analysis methods and data visualization; communicating data-backed conclusions.
- Familiarity and capability with JIRA, Confluence, Project Management software tools.
- Having an innovative mindset which is open to improve upon any process or product.