About the role
AI summarisedSenior/Engineer, Process Engineering in Advanced Packaging at ASM, a semiconductor equipment company. The role involves developing and optimizing thin-film deposition and surface preparation processes for advanced packaging applications, working in a cleanroom environment with cross-functional teams.
EquipmentFull-timeProcess development
Key Responsibilities
- Support the development and optimization of semiconductor processes for advanced packaging applications, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation
- Assist with planning and executing experiments, applying structured problem-solving and basic DOE concepts
- Collect, analyze, and document experimental data to support process learning and improvement
- Develop new films or processes for emerging packaging applications like hybrid bonding and perform advanced materials characterization
- Perform hands-on work with process equipment under guidance, including basic troubleshooting and tool characterization
- Collaborate with cross-functional teams such as equipment engineering, applications, and R&D to support process integration
- Contribute to technical documentation, reports, and internal knowledge sharing
- Learn and apply safe working practices in laboratory and cleanroom environments
Requirements
- Ph.D. or Master's in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field. Bachelor's with strong research background can be considered
- Academic, internship, or project experience in semiconductor processing, materials science, or microelectronics
- Familiarity with at least one thin-film deposition or process technique (e.g., ALD, CVD, PECVD, PVD, electrochemical processes) through coursework or lab work
- Exposure to hybrid bonding concepts, surface preparation, or integration topics through academic projects
- Basic understanding of experimental methods, data analysis, or statistical concepts
- Exposure to materials or surface characterization techniques through university labs or projects (e.g., SEM, AFM, XRD, ellipsometry)
- Strong curiosity, learning mindset, and willingness to develop hands-on technical skills
- Ability to communicate clearly and work effectively in a collaborative, multicultural environment
- Internship, co-op, or thesis experience related to semiconductor manufacturing or advanced packaging
- Experience writing technical reports or presenting project results
- Interest in working closely with complex equipment and understanding how processes translate to customer applications
- Motivation to grow into deeper technical ownership and future engineering leadership