Micron Technology

Dry Etch - MTS, PD, Advance NAND

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 1 week ago

About the role

AI summarised

As a Member of Technical Staff (MTS) in Micron's Next Generation NAND R&D Dry Etch team, you will lead the development of advanced dry etch processes for critical NAND modules such as HAR, tier-by-tier etches, WL contacts, and staircase. You will collaborate with process integration, hardware, and multi-functional teams to drive technology roadmaps, solve complex structural problems, and mentor junior engineers. The role requires deep expertise in plasma etch fundamentals, process control, and scalability challenges, with a strong preference for candidates skilled in data science, Python, and AI-assisted development.

IDMOnsite

Key Responsibilities

  • Lead development of Dry Etch technology and essential modules
  • Develop/innovate dry etch processes to meet structural and electrical specifications
  • Work closely with hardware teams to develop the equipment roadmap for current and upcoming NAND products
  • Collaborate and lead multi-functional teams to solve complex structural problems
  • Present process and technology development plans for current and upcoming technology nodes
  • Stay proactive in predicting when and how future issues could arise and build mitigation plans
  • Contribute towards Technical Leadership Program
  • Work on critical modules such as HAR, tier-by-tier etches, WL contacts & staircase
  • Find opportunities & drive towards collaborative solutions

Requirements

  • Demonstrated interest in research and development environment
  • 6-10 years’ experience in dry etch process development in R&D moving into manufacturing
  • 4-5 years of pertinent experience in NAND, DRAM, or Logic module development, such as projects and deliveries involving multi-functional groups
  • Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework
  • Demonstrated leadership in problem-solving. Experience in managing technical projects
  • Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries)
  • Expertise in statistical process control and analysis
  • Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes
  • Lead supplier head-to-heads
  • Data science basics / Python coding / AI coders shall be preferred over candidates without this experience
  • Strong computer skills, including MS Office, and SAS software like JmP and similar
  • PhD or equivalent experience in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or related fields with a minimum of 10 years’ experience in dry etch process development
  • Bachelors/Masters (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or related fields) with a minimum of 12 years of applicable dry etch process development experience