About the role
AI summarisedThe Package Health Analyst at Micron Technology will develop and execute package health monitoring, simulation, and characterization activities. This role involves hands-on engineering in DFT, data analysis, and reliability testing to ensure robust packaging solutions in the semiconductor industry.
IDMFull-timeHIG
Key Responsibilities
- Define quantitative package health metrics. Develop detection mechanisms and monitoring dashboards for continuous health assessment. Perform electrical and mechanical characterization of packages.
- Implement real-time defect detection and classification (critical vs. non-critical). Conduct next-level characterization for critical defects and integrate findings into predictive models.
- Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes. Build and maintain a structured knowledge base for package health learnings to enable NPI handover and future technodes.
- Collaborate with process and equipment engineers to establish traceability across wafer, assembly, and test stages. Develop data pipelines and tools for linking process parameters, equipment signals, and defect signatures.
Requirements
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, or related field.
- 3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering.
- Strong data analytics and statistical modeling skills. Proficiency in Python/R for data analysis and visualization is a plus.
- Strong understanding of semiconductor packaging process, material interaction and properties.
- Ability to work cross-functionally with process, equipment, and reliability teams.
- Experience with AI/ML tools or statistical modeling.
- Knowledge of defect inspection systems and inline metrology.
- Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking).
- Strong problem-solving and documentation skills.