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Micron Technology

PRINCIPAL ENGINEER - CMP PROCESS DEV

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time2 weeks ago
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About the role

AI summarised

Principal Engineer for CMP Process Development at Micron's NAND Process Development team in Singapore. Responsible for leading CMP process characterization and development for advanced 3D NAND nodes, collaborating with global teams, and transferring processes to high-volume manufacturing.

IDMFull-timeSTPG

Key Responsibilities

  • Own and lead Chemical Mechanical Planarization (CMP) process characterization and advanced process development for 3D NAND and future technology nodes.
  • Collaborate with Process Development teams in Singapore, the US, Taiwan, IDF, and key vendors to develop and integrate CMP processes aligned with next‑generation NAND technology requirements.
  • Transfer developed CMP processes to high‑volume manufacturing (Fab10N) and drive continuous improvements in yield, performance, and manufacturability.
  • Develop and execute strategies to expand process margins, including consumables development, equipment and hardware evaluations, and testing of novel applications.
  • Design, execute, and analyze experiments to validate process robustness, manufacturability, and technology scaling readiness.
  • Serve as a technical subject-matter expert contributing to critical technology decisions, process improvements, and roadmap direction for advanced NAND nodes.
  • Identify and implement process simplification and manufacturing optimization opportunities to improve cost, productivity, and cycle time.
  • Develop and deploy advanced process monitoring and control methodologies to ensure stable and repeatable manufacturing performance.
  • Lead and participate in complex, cross‑functional projects of strategic importance, influencing technical direction and execution outcomes.
  • Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

Requirements

  • PhD with ≥5 years, or Master's degree with ≥7 years, or Bachelor's degree with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field, with demonstrated expertise in leading edge CMP polishing equipment such as EBARA WS or AMAT.
  • Deep technical expertise in CMP Process Development - Hands-on mastery of CMP equipment operation, polishing mechanisms (dielectric and metal), slurries, pads, conditioning, and process optimization for advanced nodes.
  • Strong understanding of integration and structural impacts related to film deposition and CMP within NAND/Memory processes.
  • Strong Analytical & Problem Solving Capability - Ability to perform root-cause analysis using data analytics tools (e.g., Y3) and interpret complex experimental data.
  • Possess sound critical decision-making in ambiguous, high-impact process or yield scenarios.
  • Working knowledge of Design of Experiments (DoE) for systematic process development.
  • Technical Leadership & Cross-Functional Collaboration - Ability to lead and mentor junior CMP engineers, driving technical rigor and standards.
  • Proven collaboration with global and cross-site teams, including effective communication across local and remote environments.
  • Capability to manage multiple technology development projects concurrently in a fast-paced, changing environment.