About the role
AI summarisedPrincipal/Senior Process Engineer at ASM, a semiconductor equipment company, focusing on advanced packaging process development including thin-film deposition (ALD, PECVD, PVD, ECP) and hybrid bonding. Role involves research, experimentation, materials characterization, mentoring, and collaboration with customers.
EquipmentFull-timeProcess development
Key Responsibilities
- Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
- Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
- Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
- Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
- Collaborate with customers and marketing teams to define requirements and execute demonstrations.
- Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
- Draft technical papers, generate Intellectual Property, and present findings to professional audiences.
- Travel up to 10% to support remote sites and customer engagements.
- May supervise process engineering technicians and provide input on performance evaluations.
Requirements
- Bachelor's, Master's or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
- Direct experience working on D2W/W2W Hybrid bonding including surface preparation steps.
- Minimum 10 years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes.
- Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
- Knowledge of electrical characterization techniques for CMOS devices.
- Ability to manage complex process development projects, including schedules, budgets, and personnel.
- Expertise in integration advanced packaging process flows like CoWoS, SoIC, InFO.
- Experience in contributing Process and equipment qualification data towards a full Semiconductor equipment PLC process.
- Experience with advanced metrology/Inspection characterization techniques.
- Strong communication skills to convey technical concepts clearly.