About the role
AI summarisedAssociate Engineer in Failure Analysis at a leading semiconductor foundry. Responsible for hands-on failure analysis including die polishing, FIB, SEM, and EDX analysis to support root cause identification and process improvements. Works night shift in a lab environment.
FoundryFull-timeGeneral
Key Responsibilities
- Die polishing, deprocessing, die sample preparation (coater, SELA wafer cleaving, chemical decoration)
- Handling of Focused Ion Beam (FIB), Scanning Electron Microscopy (XSEM), EDX analysis tools on semiconductor devices.
- Writing detailed FA reports and update completed jobs into the FA database.
- Ensuring all FA jobs are completed within the required turnaround time.
- Accept and process FA requests from the Fab promptly and accurately.
- Support analytical, fault isolation, and failure analysis needs across the company.
- Conduct root cause failure analysis and drive process changes to eliminate recurring issues.
- Analyze reports and defective products to identify trends and recommend corrective actions.
- Review and approve FA work performed by technicians.
- Assist engineers in providing FA support for quality monitoring programs.
- Conduct training and certification for technicians on FA techniques.
- Responsible for daily preventive maintenance (PM), tool uptime, and housekeeping of FA equipment.
Requirements
- Diploma in Electronics/Mechatronics Engineering
- Experience working in a lab environment
- Fluency in English Language - written & verbal
- Can handle chemicals and no physical allergies to common solvents/acids/alkaline.