About the role
AI summarisedThis is an entry-level process development engineering role at Micron, a semiconductor memory and storage company. The engineer will support new product introduction (NPI) and process ownership for continuous improvement, focusing on assembly processes, yield enhancement, and technology enablement. The role requires a bachelor's degree in engineering and 0-2 years of experience in semiconductor packaging or process integration.
IDMFull-timeGeneral
Key Responsibilities
- Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness.
- Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work.
- Excellent execution on assembly process for 1st New Product Introduction (NPI) success and smooth transfer process from NPI to High Volume Manufacturing (HVM).
- Excellent execution of the qualification of NPI products / packages build that proliferate from the pilot products and packages according to planned timeline.
- Full responsible on support NPI business process with process Technical Risk Assessment (TRA), SPC, FMEA, Quality Control Plan (QCP), risk mitigation and documentations.
- Deliver Best In Class (BIC) yield and cost on product NPI with integration of Design for Manufacturing (DFM) package solution, process guideline and design rules.
- Collaboration with cross functional team from NPI to HVM process transfer.
- On-time execution of NPI Customer samples and Engineering Samples build for new products and packages.
- Process owner to perform on-time detection with data analysis for process yield improvement. Lead the defect elimination and continue improvement action, with problem solving methodology, statistical analysis and integration solution decision.
- Process owner to develop process recipe for BIC Units Per Hour (UPH), conducting process characterization to define process parameters and boundary.
- Continuous develop in depth assembly process technical knowledge, well understand process capability/tolerance/specification limit, and utilize key tools FMEA/QCP/Machine Alarm on assembly processes characterization/development/NPI.
- Global leader for cross team collaboration on network Best Known Method (BKM), process recipe specification and recipe standardization/conversion.
Requirements
- Minimum Bachelor's degree in Mechanical, Materials, Aerospace, Chemical, Electrical, Process, Semiconductor or related Engineering discipline.
- Fresh graduate with strong passion in semiconductor engineering is encouraged to apply. Student holding leadership roles in any academic and sport council will have added advantage.
- 0-2 years experience in semiconductor packaging, assembly, or process integration.
- Excellent data analysis, statistical analysis, data interpretation skills.
- Ability to make sound data-driven decisions. Prioritize and apply due-diligence in day to day task.
- Possess analytical and problem-solving skills.
- Keen interest in semiconductor engineering.
- Showcase leadership experience and potential.
- Strong analytical, logical, and critical thinking skills.
- Effective communicator, able to collaborate across all levels.
- Growth mindset with a passion for continuous learning.
- Internship or experience in the semiconductor industry is a plus.
- Demonstrated leadership and a track record of impact are highly desirable.
- Interest in and knowledge of the semiconductor industry and Micron is preferred.
- Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes.
- Embody Micron's core values: People, Innovation, Tenacity, Collaboration, Customer Focus.