About the role
AI summarisedThe Staff/Principal Engineer - Process Development, CMP role at Micron's NAND Process Development group in Singapore focuses on developing and optimizing Chemical Mechanical Planarization (CMP) processes for next-generation 3D NAND memory products. The position involves leading process margin improvements, collaborating with vendors, designing advanced process monitoring methodologies, and providing technical leadership on strategic roadmaps for future NAND nodes. The role requires mentoring junior staff, driving innovation through patents and technical papers, and working across global teams to ensure manufacturability and quality.
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Key Responsibilities
- Developing and optimizing CMP processes to improve product quality and reliability for next generation Micron memory parts
- Performing fundamental research, consumables development, and hardware evaluation for advanced 3D NAND CMP process development
- Testing processes for novel applications in CMP
- Initiating and managing experiments to widen process margins and evaluate manufacturability of next node solutions
- Collaborating with vendors to develop processes meeting integration requirements for current and next-generation 3D NAND nodes
- Incorporating best known manufacturing methods into early development phase of upcoming nodes
- Designing and implementing advanced process monitoring and control methodologies
- Providing strategic roadmap for N+, N++ and future NAND Nodes
- Functioning in a technical advisory role contributing to technical projects for improvements to processes, procedures, and equipment
- Defining and leading complex, multi-functional projects of critical importance to Micron, helping define strategic direction
- Providing advice and counsel to management on significant technical issues, leading and initiating innovation projects through patents/technical papers
Requirements
- At least 5 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication
- M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields
- Hands-on experience with CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment
- Experience with optical metrology, profilometry, polishing slurries, conditioners, and polishing pads
- Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology
- Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes
- Excellent oral and written communication skills with ability to convey messages concisely and effectively in local and remote communications
- Strong collaboration and communication skills (verbal and written)
- Self-driven, adaptable, and able to manage multiple projects
- Proven ability to take calculated risks and execute novel solutions
- Recognized as a mentor, team player and technical expert with ability to solicit feedback, accept input, and analyze success/failure
- Understanding of general process steps and process flow for memory processing planar and vertical NAND memory
- Strong interest in data science, modelling, and drive to use/adopt AI to optimize workflows