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Micron Technology

Dry Etch - DMTS, PD, Advance NAND

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time3 weeks ago
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About the role

AI summarised

Distinguished Member of Technical Staff (DMTS) role in Dry Etch process development for advanced NAND technology at Micron's Singapore R&D facility. The position involves leading dry etch technology roadmap, resolving complex integration challenges, mentoring engineers, and collaborating with cross-functional teams to drive innovation in next-generation NAND memory.

IDMFull-timeSTPG

Key Responsibilities

  • Leading advancements in Dry Etch technology and essential module development
  • Act as a technical expert for dry etch process, hardware and applications in NAND technology development at F10, Singapore.
  • Define the equipment roadmap. Work together with suppliers and develop a mechanism-focused logical hardware roadmap essential for the upcoming generation NAND dry etch.
  • Able to benchmark Micron NAND dry etch capability against outstanding industry standards and translate external findings into internal advantage.
  • Provides forward-looking technical insight on dry etch trends, tool capabilities, and integration risks.
  • Provide technical mentorship and direction to SMTS/STS engineers; raise overall dry etch technical capability within the Singapore NAND organization.
  • Resolve the most complex NAND yield, defectivity, and integration challenges through deep expertise in plasma physics, surface interactions, and materials.
  • Represent Micron Singapore NAND dry etch interests at international conferences, cross-site and cross-company technical forums.
  • Collaborate and lead multi-functional teams to solve sophisticated structural problems.
  • Develop and innovate dry etch methods to satisfy structural and electrical requirements.
  • Lead innovative (FOAK) dry etch process development, including recipe architecture, EPD strategy, control plans, and integration alignment.
  • Demonstrate predictive capability of a future issue and proactively build mitigation plan.

Requirements

  • Demonstrated interest in research and development environment.
  • 15-20 years' experience in dry etch process development within R&D (NAND, DRAM or Logic) moving into manufacturing roles, with 10-15 years specifically in memory products such as NAND and DRAM.
  • Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework.
  • Demonstrated leadership in problem solving. Experience in managing technical projects.
  • Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries).
  • Expertise in statistical process control and analysis.
  • Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes.
  • Lead supplier head to heads.
  • Strong computer skills, including MS Office, and SAS software like JmP and similar.
  • Data science basics / Python coding / AI coders could be preferred over candidates without this experience.
  • PhD (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or related fields) with 15-20 years of applicable dry etch process development background
  • BS/MS (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or related fields) with over 18 years of pertinent experience