About the role
AI summarisedThe Principal/Senior Engineer, Package Characterization role at Micron's Advanced Packaging Technology Development (APTD) team focuses on providing failure analysis and electrical characterization support for advanced packaging development. The engineer serves as a domain expert in package failure analysis methodologies, establishes best practices for de-processing and analysis, and collaborates with process integration, product engineering, and reliability teams to drive root cause fixes. Responsibilities include managing the failure analysis lab, maintaining equipment, ensuring compliance with safety and environmental standards, and mentoring team members through training and technical knowledge sharing.
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Key Responsibilities
- Understand PFA techniques available for de-processing failures
- Perform electrical verification to confirm failures
- Establish best known method for de-processing package
- Communicate with Internal/External Groups
- Document failure analysis techniques used to isolate failure for other groups
- Provide quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA
- Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs
Requirements
- PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline
- 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field
- Strong expertise in failure analysis methodologies and techniques
- Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques
- Strong communication skills with the ability to collaborate effectively across internal teams and external partners
- A mindset that emphasizes customer focus, continuous improvement, and striving for excellence
