About the role

AI summarised

The Engineer, Product Development Engineering Key Equipment Group (PDE KEG) at Micron is responsible for identifying, evaluating, and qualifying new semiconductor packaging equipment and technologies. The role involves collaborating with production and supplier teams to establish equipment requirements, drive equipment maturity and readiness, and support continuous improvement initiatives. This entry-level position requires foundational knowledge in semiconductor packaging and 0-2 years of relevant experience, with a strong emphasis on technical aptitude, communication, and AI-assisted workflow integration.

IDMFull-timeAssembly & Test

Key Responsibilities

Identify, select, and evaluate new equipment and technology to support current and future requirements for advanced packaging technology
Install and qualify new equipment platforms and handover to production group (Equipment Maturity Index, EMI)
Maintain a matrix of key equipment platform capability and constraints (Tool of Records, TOR) on current and new equipment platforms
Collaborate with production groups on upgrades of existing production equipment through continuous improvement projects
Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements
Contribute to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work
Support the evaluation and qualification of new equipment platforms
Define, develop, and establish new equipment design/capability requirements aligned to Process and Packaging Roadmap
Develop and engage creative solutions for new equipment capabilities/solutions to identified constraints or future technology requirements
Work with equipment suppliers to develop new capabilities
Engage in active participation in Package Development Engineering activities
Conduct equipment benchmarking to establish equipment suppliers and platforms for future need

Requirements

PhD/Master's/bachelor's degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or equivalent work experience
Basic knowledge in semiconductor manufacturing assembly, wafer bumping, packaging technologies, and advanced packaging techniques
0-2 years' experience in related semiconductor industry or related manufacturing environment
Experience with technical knowledge on assembly and/or wafer bumping and/or advanced packaging technology is a plus
Understanding and/or experience in equipment automation solutions is a plus
Fast learner, with initiative and independence (minimal supervision), good team player, ability to integrate and cooperate with cross-functional teams and external vendors
Strong communication (verbal & written) and presentation skills (English speaking is required)
Understanding business needs and customer requirements, able to participate in cross-functional team environments
Strong project management skills to ensure execution to timelines
Seasonal travel based on business need will be required
Perform hardware and software engineering assignments as required
Strong analytical, logical, and critical thinking skills
Growth mindset with a passion for continuous learning
Internship or experience in