About the role
AI summarisedPrincipal Engineer/MTS for Dry Etch process development in advanced NAND R&D at Micron Technology. The role involves leading innovation in dry etch technology, collaborating with cross-functional teams, and mentoring engineers to achieve program and yield targets for next-generation NAND products.
IDMFull-timeSTPG
Key Responsibilities
- Leading innovation in Dry Etch technology and essential module advancement
- Develop and innovate dry etch processes to meet structural and electrical specifications.
- Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products.
- Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect outcomes.
- Collaborate and lead cross-functional teams to solve complex structural problems.
- Present process and technology roadmaps for current and future technology nodes.
- Proactively predict when and how a future issue could arise and build mitigation plans.
- Contribute towards the Technical Leadership Program.
- Mentor less experienced engineers and encourage skills within the team.
- Be associated with critical modules such as HAR, Tier by tier etches, WL contacts & staircase.
- Find opportunities and drive towards a collaborative solution.
- Guide other areas on technology roadmaps.
Requirements
- Demonstrated interest in research and development environment.
- 6-10 years' experience in dry etch process development in R&D moving into manufacturing.
- 4-5 years of applicable NAND, DRAM, or Logic module development experience, for example: projects and deliveries involving cross-functional teams.
- Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework.
- Demonstrated leadership in problem-solving. Experience in managing technical projects.
- Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries).
- Expertise in statistical process control and analysis.
- Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes.
- Lead supplier head-to-heads.
- Data science basics/Python coding/AI coders shall be preferred over candidates without this experience.
- Strong computer skills, including MS Office, and SAS software like JMP or similar.
- Masters/PhD or equivalent experience in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering, or related fields, along with at least 6 years of pertinent dry etch process development experience.
- Bachelors/Masters (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering or related fields) with at least 10 years of pertinent dry etch process development experience.