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Micron Technology

Staff Engineer, Package Development & Engineering

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time3 months ago
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About the role

AI summarised

Staff Engineer leading advanced packaging technology development at Micron, a semiconductor memory company. Responsible for driving technology enablement, yield acceleration, and integration of next-generation packaging solutions, managing cross-functional teams and governance frameworks.

IDMFull-timeAssembly & Test

Key Responsibilities

  • Own the full lifecycle of PDE technology pillars, including roadmap definition, execution, and closure.
  • Define technical objectives, key deliverables, and resource allocation for pillar initiatives.
  • Lead cross-functional engineering teams across TD, HVM, CPI, DRAM, and NPI to achieve aggressive technology milestones.
  • Develop and enforce standardized methodologies for technical program management and pillar governance.
  • Drive CapEx/OpEx planning, PTM and MOR processes, and integration of BOP design systems.
  • Ensure compliance with internal governance models and customer technical requirements.
  • Align pillar objectives with PDE's mission to embed analytics, simulation, and advanced modeling into development workflows.
  • Facilitate technical communication across BU, PDT, TPM, and central engineering teams.
  • Provide leadership updates on technical progress, risks, and mitigation strategies.
  • Define and monitor KPIs for technology maturity, yield performance, and EOL accountability.
  • Conduct technical reviews to validate outcomes and capture lessons learned.
  • Mentor engineers and promote best practices for technical program management.

Requirements

  • Bachelor's or Master's degree in Engineering, Materials Science, or related technical discipline.
  • 8+ years of experience in semiconductor packaging, process integration, or technology development.
  • Proven ability to lead complex, cross-functional technical programs in a high-tech environment.
  • Deep understanding of advanced packaging flows including hybrid bonding, CoWoS, and chiplet integration.
  • Strong technical communication and leadership skills.
  • Familiarity with Micron's PDE, CPI, and NPI frameworks.
  • Expertise in simulation modeling, yield enhancement, and defectivity analysis.