Jobfoundry
Jobfoundry
GlobalFoundries

Engineer, Tapeout Engineering

GlobalFoundries
Foundry OperationsSingaporeOnsitePosted 4 weeks ago
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About the role

AI summarised

As a Tapeout Engineering (D2P) Engineer, you will play a key role in supporting semiconductor mask data preparation and tapeout activities. This involves contributing to layer generation, OPC/ORC integration, and end-to-end tapeout flows while ensuring quality, consistency, and risk mitigation across manufacturing and digital application processes. You will collaborate closely with cross-functional teams in an Agile environment.

FoundryOnsite

Key Responsibilities

  • Support semiconductor mask data preparation and tapeout activities, including layer generation and integration of OPC and ORC processes.
  • Collaborate with cross-functional teams to support pre-tapeout design flows, frame generation, and end-to-end tapeout schedules to meet customer requirements.
  • Assist in problem solving, planning, and testing across the tapeout and mask build flow to ensure accurate and on-time photomask delivery.
  • Participate in continuous improvement and automation initiatives to enhance tapeout and mask data preparation workflows.
  • Design and execute functional and end-to-end test cases; support System Integration Testing (SIT) and User Acceptance Testing (UAT).
  • Validate positive and negative flows, edge cases, and basic non-functional requirements such as performance and security awareness.
  • Identify requirement gaps, inconsistencies, and risks early, providing technical feedback under senior guidance.
  • Log, track, and triage defects; contribute to root cause analysis, quality metrics, and continuous improvement initiatives.

Requirements

  • Bachelor’s Degree in Engineering, Computer Science, Electronics, Electrical Engineering, or a related technical discipline.
  • Experience or strong interest in semiconductor manufacturing flows, mask data preparation, or tapeout processes.
  • Foundational knowledge of photomask generation, OPC/ORC concepts, and pre-tapeout design flows.
  • Exposure to Agile or DevOps environments, with understanding of sprint-based development and quality engineering practices.
  • Experience designing and executing functional and end-to-end tests, defect tracking, and test documentation.
  • Strong analytical and problem-solving skills with attention to detail and process quality.
  • Effective communication skills with the ability to collaborate across engineering, product, and manufacturing teams.