About the role
AI summarisedThe Principal/Senior Engineer in APTD CEM focuses on developing and deploying post-fab wafer finishing processes for advanced packaging, particularly for high bandwidth memory (HBM) products. The role involves establishing wafer-level process conditions, evaluating new equipment and materials, ensuring quality through measurement and testing, and coordinating cross-functional teams for technology transfer to high-volume manufacturing. This position supports Micron’s innovation in memory technologies by enabling scalable, reliable, and cost-effective advanced packaging solutions.
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Key Responsibilities
- Establish and improve wafer level process conditions and technologies (wafer thinning, backside metal interconnect)
- Upgrade process capabilities and reduce production costs
- Establish and improve process management projects to deliver technology node requirements and scaling for next node
- Evaluate and promote new equipment and materials to enhance process capabilities
- Set up process parameters for a variety of semiconductor equipment
- Evaluate, promote, and plan for new equipment and materials
- Ensure defense coverage through process, measurement, inspection, and testing
- Establish correlations between defense mechanisms to identify improvement opportunities
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
- Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
- Work closely with various teams, including Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
Requirements
- B.S/M.S./Ph.D. (or equivalent education) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 2 or more years of semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
- Experience with Visual Basic for automation and tool integration.