About the role
AI summarisedDrive and manage silicon Bump & package assembly suppliers, backend processes, and solutions to achieve aggressive TQRDCEB goals. This role involves close collaboration with various engineering teams to support new product and technology introductions by defining processes, monitoring systems, and managing improvements.
FablessOnsite
Key Responsibilities
- Drive and manage silicon Bump & package assembly suppliers, backend processes, and solutions to meet aggressive TQRDCEB goals.
- Collaborate with package design, test & product engg, production planning, quality engg, and NPI teams to support new product introductions.
- Define processes, monitor systems, and manage process improvements and changes for bump and assembly suppliers and internal teams.
- Plan, drive, and implement improvement activities focused on continual improvement, 2nd sourcing, cost reduction, and customer satisfaction.
- Provide day-to-day technical support to bump and assembly suppliers, planning, product, and test engineering teams.
Requirements
- PhD / Master's Degree in Mechanical, Electrical, or Electronics Engineering.
- 7-12 years of relevant experience managing advanced node silicon bumping, large body single & multi-chip (2.1/2.5/3D) package assembly, substrate, and back-end suppliers/processes.
- Hands-on experience in Product Life-Cycle Management (creating BOM structure, Process Documentation, PCN).
- Strong project management skills and experience with failure analysis tools/techniques.
- Sound knowledge of applicable industry standards, quality systems, and regulations.
- Knowledge of prevailing and emerging silicon package & substrate technologies, bumping, assembly processes, materials, and equipment.
- Ability to communicate effectively with global internal teams and external partners; occasional travel required.