About the role
AI summarisedPrincipal/Senior Engineer in Advanced Packaging Technology Development at Micron, focusing on wafer-level process development for high-performance memory products like HBM. Responsibilities include developing post-fab wafer finishing processes, equipment evaluation, quality improvement, and cross-team collaboration. Requires a degree in engineering or physics, 2+ years semiconductor process experience, and proficiency in data analytics tools.
IDMFull-timeHIG
Key Responsibilities
- Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)
- Upgrade process capabilities and reduce production costs
- Establish and improve process management projects to deliver technology node requirements and scaling for next node
- Evaluate and promote new equipment and materials to enhance process capabilities
- Set up process parameters for a variety of semiconductor equipment
- Ensure defense coverage through process, measurement, inspection, and testing
- Establish correlations between defense mechanisms to identify improvement opportunities
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
- Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
- Work closely with various teams, including Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
- Ensure smooth transition from new product development, qualification, small volume production to high volume production
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities
Requirements
- B.S/M.S./Ph.D. (or equivalent education) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 2 or more years of semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics
- Experience with Visual Basic for automation and tool integration
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
- Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
- Tenacity to work effectively under timelines and limited resources
- Consistent track record to solve problems and address root causes