Micron Technology

Dry Etch Staff/Principal Engineer - Advanced NAND

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time4 months ago

About the role

AI summarised

Staff/Principal Engineer role in Micron's NAND R&D Dry Etch team, focusing on developing and innovating dry etch processes for next-generation NAND memory. Responsibilities include leading critical module development, collaborating with cross-functional teams, and driving process roadmaps. Requires 3-10 years of dry etch experience, knowledge of plasma physics, and expertise in statistical process control.

IDMFull-timeSTPG

Key Responsibilities

  • Leading Dry Etch unit process and critical module development
  • Develop/innovate dry etch processes to meet structural and electrical specifications
  • Collaborate and lead cross functional teams to solve complex structural problems
  • Present process and technology roadmaps for current and future technology nodes
  • Associated with critical modules such as HAR, Tier by tier etches, WL contacts & staircase
  • Identify opportunities & drive towards a collaborative solution
  • Guide other areas technology roadmaps
  • Lead or be a part of cross functional task force groups driving towards a target
  • Develop basic knowledge tending to expertise in other areas process hardware, or technologies
  • Be a resource and mentor for peers in dry etch technology and/or project management
  • Provide critical updates to upper management on project status and impacts

Requirements

  • Demonstrated aptitude for a research and development environment
  • 3-10 years' experience in dry etch process development in R&D transferring to manufacturing
  • 2-3 years of relevant NAND, DRAM or Logic module development experience, e.g.: cross-functional teams projects and deliveries
  • Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework
  • Demonstrated leadership in problem solving. Experience in managing technical projects
  • Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries)
  • Expertise in statistical process control and analysis
  • Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes
  • Demonstrated ability to lead supplier head to heads
  • Data science basics / Python coding / AI coders shall be preferred over candidates without this experience
  • Strong computer skills, including MS Office, and SAS software like JmP and similar
  • Masters / PhD (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with 4-10 years of relevant dry etch process development experience
  • Bachelors (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with 7-12 years of relevant experience