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Micron Technology

Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 4 weeks ago
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About the role

AI summarised

Senior Product Engineer in Micron's Heterogeneous Integration Group focusing on High Bandwidth Memory (HBM) product engineering. The role involves leading a team to improve assembly and HBM cube yield, driving process conversions, mentoring team members, and collaborating across functions to ensure product quality and innovation. The position requires a bachelor's or master's degree in engineering with at least 3 years of relevant experience, strong leadership and technical skills, and willingness to travel internationally.

IDMOnsiteHIG

Key Responsibilities

  • ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process.
  • HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield.
  • Root Cause and Resolution of Qual and RMA Packaging Issues: Debug and identify root cause and failures in by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
  • Backend Process Conversions and HVM: Work with FAB, Technology Development, Advanced Packaging TD, Package Development Teams to establish a robust Process Conversion Business Process to facilitate Yield Improvement, DPM Improvement and overall performance of HBM Products.
  • Provide recommendation to PDE teams for new process conversions to reduce cost, increase yields.
  • Mentorship and Development: Actively mentor and develop team members to foster growth and development within the team and the organization.
  • Cross-Functional Collaboration: Work closely with various cross-functional teams, including Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams, to ensure the holistic development and successful shipping of end products.
  • Promotion of Innovation: Promote innovation and drive changes that provide a technical advantage over competitors, maintaining the company's competitive edge in the market.
  • Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
  • AI/ML Advocate: Collaborate with cross-functional teams to develop, deploy, and validate AI/ML models aimed at enhancing key performance indicators (KPIs) such as Quality, Cost, Cycle Time, and Scale.

Requirements

  • Bachelors/Masters of Electrical/Electronic/Mechanical Engineering Degree with 3 years of relevant experience.
  • Demonstrating Strong Leadership Skills and Technical Skills experience with problem solving with root cause understanding and solution space through in depth circuit analysis.
  • Good knowledge of statistics and data analysis tools and scripting.
  • Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
  • Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
  • Strong sense of responsibility and accountability towards assigned role with professional work ethic.
  • Excellent communication and presentation skills.
  • Passionate about people leadership, with a drive toward ongoing learning and development in this area.
  • Work on site in Singapore with international travel to Taiwan, US, Japan.