About the role
AI summarisedThe Senior/Staff Engineer, Process Integration, NTI NAND role at Micron Technology in Singapore involves owning and driving the development of process modules for next-generation 3D NAND products. The engineer will define specifications, lead cross-functional teams, optimize performance and yield, innovate materials, and support technology transfer from R&D to manufacturing. Success requires strong analytical, communication, and leadership skills, along with hands-on experience in semiconductor process integration and NAND technologies.
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Key Responsibilities
- Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit
- Define structural specifications and process requirements for assigned modules
- Set a clear direction and vision for the module and have a well-defined continual improvement plan
- Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control
- Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization
- Analyze materials physically, electrically, etc. and work with process groups to select new material for development
- Design and execute device and process experiments to perform process development and process integration
- Provide team leadership in module development with assembling and coordinating a development team including process engineers
- Make key decisions for the team, as well as provide clear direction, goals and metrics for success of the team
- Innovate to address complex problems through both design and process and consider new options for improving and developing new technologies or devices
- Coordinate activities such as reticle tapeouts, flow/traveler changes, lot management, etc. across cross-functional teams
- Support the transfer of new technology from R&D to high volume manufacturing
Requirements
- Passionate about semiconductor technology and innovation
- Adept at data analysis, problem-solving, and process integration optimization
- Excellent communication skills and capacity to collaborate within cross-functional teams
- Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc.
- Minimum of 3 years of experience in the semiconductor industry in the Process Areas or Process Integration
- Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms
- In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues
- Experience in R&D and technology transfer within Semiconductor industry
- Committed to quality, collaboration, and continuous improvement
- Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment
- BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field
