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Micron Technology

Senior Member of Technical Staff, NAND Advanced Thin Films Process Development

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time3 weeks ago
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About the role

AI summarised

Senior Member of Technical Staff role at Micron Technology, a leading semiconductor company, focused on advanced thin film process development for 3D NAND. The position involves defining technical strategy, leading multi-functional projects, mentoring engineers, and driving innovation in thin film deposition and characterization. Requires deep expertise in CVD, ALD, and hardware optimization with 15-20 years of experience.

IDMFull-timeSTPG

Key Responsibilities

  • Define technical strategy and lead multi-functional projects in structural and electric film development.
  • Architect solutions and promote innovative technologies across teams.
  • Influence technical standards and drive process improvements.
  • Lead advanced process development, fixing, and integration.
  • Mentor engineers and foster technical growth.
  • Participate in global collaborations aligned with Micron's engineering expectations.
  • Integrate unit processes into full module packages and validate within and cross-module interactions, device/process linkages via wafer-level electricals.
  • Drive complex problem solving across process/structure/hardware/device interactions—root cause analysis, FMEA, SPC, and corrective actions that recover window with no yield trade-off.
  • Utilize advanced characterization (SIMS, XPS, TEM, EDX/EELS, electrical stress testing, TDS) to correlate process parameters to device performance; derive correlation models that predict reliability and scaling behavior.
  • Lead multi-functional teams and vendor engagements to push hardware/process capability, set achievements, and secure resources.
  • Mentor engineers via structured training, case studies, and hands-on development; contribute to Micron's mentoring programs and help build SME pipelines for Advanced Thin Films.
  • Publish internal papers, BKMs, and present to senior leadership; uphold Micron's TLP tenets: Innovate, Focus, Impact, Influence, Lead, Mentor.

Requirements

  • PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or related field.
  • 15 to 20 years of experience in Thin Film research and development for NAND process specifically plasma and thermal CVD for dielectric (including high K and low K) and carbon-based depositions.
  • Demonstrated leadership in multi-functional development and vendor collaboration.
  • Proven track record in architecting solutions, process-device correlation, and mentoring engineers—aligned to Micron's SMTS leadership expectations.
  • Advanced proficiency in thin film processing (Plasma Enhanced CVD, Thermal CVD, ALD).
  • Hands-on experience with structural and electric film hardware and equipment optimization (dielectric and carbon based films).
  • Hardware optimization: Precursor delivery & temperature control, chamber matching/segregation, batch vs single wafer trade-offs, metrology hooks.
  • Strong understanding of process-mechanical-device interactions, reliability modeling, and 3D NAND scaling.
  • Skilled in advanced characterization techniques (SIMS, XPS, TEM, electrical stress testing) and correlating process parameters to structural and device performance.
  • Proven ability to lead technical problem-solving and support engineers developing their skills.