About the role
AI summarisedSenior/Staff NAND Module Process Integration Engineer at Micron Technology in Singapore, responsible for designing and integrating process solutions for next-generation 3D NAND product yield and quality. The role involves leading process modules, defining specifications, driving innovation, and coordinating cross-functional teams in a semiconductor R&D environment.
IDMFull-timeSTPG
Key Responsibilities
- Module Ownership: Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
- Specification definition: Define structural specifications and process requirements for assigned modules.
- Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan.
- Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach.
- Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
- Material Innovation: Analyze materials physically, electrically, etc. and work with process groups, etc to select new material for development. Drive material changes from research into production.
- Design Experiments: Design and execute device and process experiments to perform process development and process integration. Extract, analyze, report and draw logical conclusions on experiments and clarify the statistical significance of the data.
- Team Leadership: Provide team leadership in module development with assembling and coordinating a development team including process engineers, etc.
- Decision-Making & Goal Setting: Make key decisions for the team, as well as provide clear direction, goals and metrics for success of the team.
- Innovation & IP Generation: Innovate to address complex problems through both design and process. And consider new options for improving and developing new technologies or devices. Patent disclosures are expected on a regular basis.
- Cross-Functional Coordination: Coordinate activities such as reticle tapeouts, flow/traveler changes, lot management, etc. across cross-functional teams to enable a project to proceed in a rapid and low error manner.
- Technology Transfer: Support the transfer of new technology from R&D to high volume manufacturing.
Requirements
- Passionate about semiconductor technology and innovation.
- Adept at data analysis, problem-solving, and process integration optimization.
- Excellent communication skills and capacity to collaborate within cross-functional teams.
- Bachelors or Masters or PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field.
- Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
- Minimum of 3 years of experience in the semiconductor industry in the Process Areas or Process Integration.
- Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
- In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
- Experience in R&D and technology transfer within Semiconductor industry.
- Committed to quality, collaboration, and continuous improvement.
- Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.