About the role
AI summarisedSr Mgr, Bump/DPS & Assembly Engineering role at Qorvo in Singapore.
IDMOnsiteManagement
Key Responsibilities
- Early engagement and execution of Packaging Technology development working with OSAT partner on-site aligned with corporate roadmap to meet future Qorvo Business Unit needs
- Utilize program management methodology to plan, execute, and monitor complex process and/or product development projects
- Provide best-in-class industry know-how to enable continued global leadership of QORVO package solutions
- Manage and coach QI’s engineering resources from the daily work
Requirements
- Strong problem-solving skills in Assembly engineering
- Leadership experience working with OSAT partners and cross-functional teams
- Strong communication and presentation skills
- Ability to excel in a dynamic collaborative team environment, including working directly with R&D, Quality, and Product line
- Ability to think and act professionally as a Qorvo engineering representative at the on-site OSAT
- Experience managing other work centers upon request