About the role
AI summarisedThe Principal/Senior Engineer in Advanced Packaging Integration Engineering at Micron's APTD team focuses on developing and deploying advanced packaging technologies for high-performance memory products. Responsibilities include improving yield, quality, and productivity through silicon package integration innovation, data analysis, and cross-functional collaboration with process, product, probe, yield analysis, test, and product engineering teams. The role supports the transfer of package development to manufacturing for AI-driven solutions like HBM.
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Key Responsibilities
- Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
- Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
- Integrate semiconductors while partnering with process and product engineering teams
- Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements
- Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
- Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements
- Ensure defense coverage through process, measurement, inspection, and testing
- Establish correlations between defense mechanisms to identify improvement opportunities
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
Requirements
- will result in immediate disqualification.