About the role
AI summarisedInternship in semiconductor assembly process engineering at Micron, focusing on Flip Chip Attach and Underfill technologies. The intern will drive process development, yield improvement, and data-driven decision-making using statistics and AI.
IDMFull-timeAssembly & Test
Key Responsibilities
- Setup, execute, and analysis of Flip Chip Attach and Underfill process experiments.
- Collaborate with cross-functional teams to troubleshoot and resolve process issues and work on engineering projects.
- Apply statistical methods to analyze process data and identify trends or anomalies.
- Explore AI-based approaches for predictive modeling and process optimization.
- Deliver a final presentation summarizing key learnings, challenges, and recommendations.
- Contribute to at least one yield improvement or defect reduction initiative.
- Develop a simple AI model or script to support process monitoring or defect prediction.
Requirements
- Degree in Mechanical/Chemical/Material Science Engineering.
- Internship availability from January to May 2026.