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A*STAR

Scientist (Heterogeneous Integration), IME

A*STAR
ResearchSingaporeFull-time3 weeks ago
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About the role

AI summarised

The Institute of Microelectronics (IME) is seeking a Scientist or Senior Scientist to join its Heterogeneous Integration Department, focusing on advancing chip-to-wafer and wafer-to-wafer hybrid bonding processes for 2.5D and 3D packaging applications. The role involves leading projects, developing fabrication techniques, conducting reliability characterization, and mentoring junior staff in a research-oriented semiconductor environment.

ResearchFull-timeInstitute of Microelectronics

Key Responsibilities

  • Collaborate with senior staff, process integrators, and external partners to address technology roadmaps, process capability requirements, and business challenges.
  • Lead high-impact projects with manageable risks and mentor less experienced colleagues.
  • Conceive and plan projects involving new materials, advanced process integration approaches, and innovative concepts.
  • Research and develop advanced packaging technology such as flip-chip & hybrid bonding techniques for 2.5D and 3D IC applications.
  • Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield.
  • Optimise die bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
  • Conduct engineering experiments for process characterisation to drive quality and yield improvements.
  • Perform reliability characterisation of hybrid-bonded packages to ensure robustness and long-term performance.
  • Act as a subject matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
  • Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.
  • Work with minimal supervision and should be a team player.

Requirements

  • PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
  • 0 to 5 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogeneous integration applications.
  • Knowledge in hybrid bonding or flip chip bonding is a plus.
  • Strong knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterisation is preferable.
  • Strong analytical and problem-solving skills.
  • Proficiency in data analysis and interpretation and design of experiments.
  • Excellent written and verbal communication abilities.
  • Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders).
  • Demonstrated ability to manage multiple tasks and projects simultaneously.
  • Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.
  • Proven ability to troubleshoot and resolve process-related challenges.