About the role
AI summarisedThe Member of Technical Staff in NAND Advanced Thin Films Process Development leads experiments and process development for dielectric and carbon-based thin films in NAND memory technology. The role involves material characterization, process integration, and collaboration with cross-functional teams to drive manufacturability and technology advancement. Responsibilities include mentoring junior staff, maintaining technical records, and supporting continuous improvement initiatives.
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Key Responsibilities
- Lead project-level initiatives focused on the development of structural and electrical film processes, especially dielectric (including Low and High K) and Carbon based films
- Carry out complex experiments and support process integration under the guidance of senior staff members
- Collaborate with various functions to facilitate technology transfer and assist in process ramp-up activities
- Maintain accurate and thorough records of experiments and processes, and prepare comprehensive technical reports
- Mentor staff members early in their careers and provide leadership that aligns with TLP entry expectations
- Support initiatives aimed at continuous improvement and optimization of existing processes
- Participate in multi-functional problem-solving teams to address process challenges and drive innovation
- Know the latest with emerging technologies, industry trends, and advancements in thin film processing and characterization
Requirements
- Demonstrated expertise in thin film deposition techniques, such as Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (plasma and thermal), including recipe setup, process tuning, and fixing
- Proficiency in using metrology tools—including ellipsometry, X-ray reflectivity (XRR), Scanning Electron Microscopy (SEM), and Transmission Electron Microscopy (TEM)—for material characterization and process monitoring
- Solid understanding of process integration, defect analysis, and methods for yield improvement
- Familiarity with electrical evaluation methods and Fab metrology tools, such as CD-SEM, thickness measurement instruments, and particle counters
- Competence in process optimization, documentation, and data analysis, including statistical process control (SPC), design of experiments (DOE), and root cause analysis
- Experience with fixing process issues, implementing corrective actions, and supporting technology transfer from R&D to manufacturing
- Ability to communicate technical findings effectively, both verbally and in writing, to diverse audiences