About the role
AI summarisedThe Product Integration Lead for HBM drives alignment between silicon and system requirements, coordinates cross-functional teams to resolve gaps, manages sample delivery and qualification changes, and leads triage efforts for system-chip interactions to ensure timely delivery of high-bandwidth memory solutions.
IDMOnsiteHIG
Key Responsibilities
- Manage technical inputs and drive silicon-system alignment on requirements and commitments using the Success Criteria Document (SCD)
- Collaborate with HBM Architecture, Product and Systems Engineering, Business Unit, Technology Development, Packaging and Global Quality Teams to achieve competitive systems and resolve any gaps between HBM commit and system requirements
- Understand sample usage and any gaps in capability to system requirements, managing HBM sample delivery in sync with system development needs and timelines. Assist with risk assessment of identified issues
- Lead Triage Team for any System or Chip Feature Interaction requiring clarity of failure ownership domain. Coordinate mitigations with key stakeholders
- Communicate proper priorities within HBM Development team to maintain focus on achieving system specs and address concerns with Component and System teams
Requirements
- Bachelor’s Degree or Master’s Degree in Electrical or Computer Engineering .
- 10+ years of demonstrated ability in Product, Design, Yield Enhancement, or related engineering fields. Experience with product development projects is a plus .
- Proven capability to lead technical issues to closure with creative, effective solutions through a highly collaborative approach.
- D esire to develop knowledge and expertise in overall HBM to System development. Knowledge of DRAM/HBM device/design and system management is beneficial.