Micron Technology

Intern - HIG HBM PACKAGE PSE

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 5 months ago

About the role

AI summarised

This internship role involves supporting the Heterogeneous Integration Group in developing a defect library dashboard for High Bandwidth Memory (HBM) products. The intern will analyze electrical and physical failure signatures of defects across test flows and contribute to creating a standardized tracking system. The position requires foundational knowledge in semiconductor physics and Python programming, with a preference for candidates pursuing advanced degrees in relevant engineering disciplines.

IDMOnsiteHIG

Key Responsibilities

  • Understand the electrical failing signature(s) of different defect fail modes across the process and how they fail in each test flow
  • Create a user-friendly dashboard to track and document all defect fail modes
  • Document the electrical/physical fail signature of defects of interest for the HBM defect library
  • Support standardization of tracking for defect fail modes within different test flows

Requirements

  • Python coding skills
  • Basic knowledge of semiconductor physics
  • Currently pursuing or recently completed MSc in Electrical Engineering, Material Science & Engineering, or Semiconductor Technology & Operations
  • Minimum availability of 6 months for the internship duration