About the role
AI summarisedDrive the development and optimization of advanced wafer level packaging processes in a high-impact research role, contributing to groundbreaking technologies at the forefront of semiconductor packaging.
ResearchOnsiteInstitute of Microelectronics
Key Responsibilities
- Lead the design and development of advanced assembly processes, including 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.
- Plan, coordinate, and execute comprehensive evaluations of processes, equipment, and materials.
- Partner with project leaders to align on requirements and enhance capabilities to meet evolving project needs.
Requirements
- Master's or Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
- Hands-on experience in process development or packaging R&D.