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Micron Technology

ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time1 months ago
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About the role

AI summarised

Early-career engineer role at Micron Technology supporting NAND package and silicon integration for next-generation memory products. The position involves chip-package interaction assessments, design rule learning, and cross-functional collaboration with silicon design, wafer fabrication, and assembly teams in a high-volume manufacturing environment.

IDMFull-timeAssembly & Test

Key Responsibilities

  • Support chip-package interaction (CPI) assessments by collecting data, performing basic analysis, and documenting results under guidance from senior engineers.
  • Assist package design, scribe design, and assembly engineers in investigating wafer dicing, singulation, and integration topics.
  • Participate in DFMEA / PFMEA activities by helping prepare inputs, reviewing risk items, and tracking action items.
  • Work with wafer fab, R&D, and manufacturing teams to support yield, quality, and manufacturability issue investigations.
  • Support execution of test vehicles and DOEs, including data collection, basic analysis, and report preparation.
  • Learn Micron's package and silicon development flows, design rules, and change-management processes.
  • Prepare technical documentation and presentation materials for design reviews, project updates, and knowledge sharing.
  • Escalate technical issues and risks promptly and seek guidance when encountering unfamiliar problems.

Requirements

  • Bachelor's or Master's degree in Engineering (Mechanical, Materials Science, Electrical, Chemical, or related discipline).
  • Less than 2 years of relevant experience, including internships, co-op programs, or research experience in semiconductor, materials, or manufacturing fields.
  • Fundamental understanding of semiconductor manufacturing and/or packaging concepts (coursework or internship level).
  • Exposure to structured problem-solving methods (FMEA, DOE, data analysis) through academics or internships.
  • Ability to follow defined engineering procedures, analyze straightforward technical problems, and learn from feedback.
  • Strong attention to detail and willingness to learn new tools, processes, and technologies.
  • Basic proficiency in Microsoft Excel, Word, and PowerPoint for data analysis and documentation.
  • Good written and verbal communication skills, with the ability to collaborate effectively in a team environment.