About the role
AI summarisedThe Director of Advanced Packaging Technology Development provides cross-departmental leadership to drive multi-functional initiatives focused on quality, cost, and production efficiency in semiconductor packaging. The role involves mentoring leaders, ensuring goal attainment, and applying deep technical knowledge in materials, processes, and packaging technologies to guide strategic direction. Candidates must have an advanced technical degree and over 10 years of semiconductor process or equipment development experience, preferably in wafer bonding, plating, warpage control, or packaging.
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Key Responsibilities
- Represent APTD in providing cross department leadership in area of responsibility
- Work effectively with peers in other department to develop and drive multi-functional initiatives
- Ensure accuracy, quality, and timeliness of results
- Guide best utilization of resources to achieve end results
- Ensure critical results, milestones and goals are met by the team
- Provide recommendations to achieve organization objectives and align group to support department objectives
- Make decisions that directly impact the achievement of work unit and sub-function objectives
- Seek out opportunities to work multi-functionally, build a network, and gain competency across domains
- Mentor, develop and motivate leaders and team members
- Cultivate effective team and leadership abilities
Requirements
- B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 10 or more years of semiconductor process or equipment development experience
- Preferably in wafer bonding, plating, warpage control and packaging field
- Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
- Ability to use extensive technical knowledge to guide strategic directions