About the role
AI summarisedThe Engineering Project Manager for APTD Operations at Micron Technology leads technology development programs and engineering builds, ensuring timely execution through integrated scheduling, risk management, and cross-functional coordination. Responsibilities include managing project documentation, optimizing build schedules and logistics, supervising wafer offloading and kitting, and driving process improvements. The role requires a bachelor’s or master’s degree in engineering, 3-5+ years of semiconductor manufacturing experience (with HBM preferred), and proficiency in project management tools, SAP, Teamcenter, MES, and standard office applications.
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Key Responsibilities
- Lead technology development programs and projects to deliver against defined go-to-market timelines
- Align program- and project-level plans, dependencies, and deliverables to ensure timely, cohesive execution
- Develop and maintain integrated project schedules in collaboration with cross-functional teams
- Ensure all deliverables and artifacts meet program requirements and align with established business processes
- Proactively identify and resolve risks, issues, and roadblocks, escalate as needed to protect timelines
- Facilitate regular project reviews and meetings to track progress and address challenges
- Monitor and communicate project status and overall program health to stakeholders
- Centralize and manage project documentation and data using SharePoint and Confluence
- Continuously improve technology development processes, tools, and systems to drive execution efficiency
- Handle technology development and engineering builds in partnership with internal and external teams
- Define and execute build plans, priorities, milestones, and schedules with cross-functional stakeholders
- Forecast build, material, cost, and resource requirements, maintaining accurate planning data and tools
Requirements
- Bachelor’s or master’s degree or equivalent experience in Materials, Mechanical, Chemical, or Electrical/Electronic Engineering
- 3-5+ years’ experience in Semiconductor Frontend/Backend Manufacturing
- Preferably minimum 1 year of HBM experience
- Experience in Project/Process Integration, Project/Program Management, Technology Development, Operations Management, or Process Engineering
- Solid understanding of advanced packaging flows
- Proficiency in essential computer applications, including Excel, Word, statistical tools, Confluence, Power BI, and Power Apps
- Knowledge of SAP, Teamcenter and manufacturing execution systems
- Knowledge of Project Management Tools/Systems
- Strong analytical and problem-solving capabilities
- Outstanding communication, leadership, and stakeholder management skills
- Ability to work independently and collaboratively in a fast-paced environment
- Demonstrated excellence in leading teams within a global manufacturing network composed of members from diverse fields and cultures