About the role
AI summarisedThe Principal/Senior Engineer in APTD CEM focuses on developing and optimizing advanced packaging assembly processes, particularly in wafer-level packaging and die stacking technologies. The role involves evaluating new equipment and materials, driving quality and yield improvements, establishing process controls, and coordinating cross-functional teams to ensure smooth technology transfer from development to high-volume manufacturing. Strong analytical skills in Python, R, SQL, and Visual Basic are required for data-driven process improvement and equipment integration.
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Key Responsibilities
- Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer
- Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
- Establish and improve process management projects to deliver technology node requirements
- Evaluate and promote new equipment and materials to enhance process capabilities
- Set up process parameters for a variety of semiconductor equipment
- Ensure defense coverage through process, measurement, inspection, and testing
- Establish correlations between defense mechanisms to identify improvement opportunities
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
- Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
- Work closely with various teams, including Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities
Requirements
- B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics
- Experience with Visual Basic for automation and tool integration
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding