About the role
AI summarisedResearch Engineer role at IME focusing on next-generation semiconductor packaging processes, including 2.5D/3D packaging, FOWLP, and hybrid bonding. The position involves process development, evaluation, and collaboration with project leaders and stakeholders.
ResearchFull-timeInstitute of Microelectronics
Key Responsibilities
- Lead the design and development of advanced assembly processes for 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.
- Coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qualifications and establish manufacturing guidelines.
- Work closely with project leaders to align on project requirements. Develop and enhance capabilities to meet evolving project needs.
- Generate detailed engineering reports and contribute to the creation of new intellectual properties (IPs) and knowledge areas (KHs). Strengthen the IP portfolio related to heterogeneous integration.
- Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs.
Requirements
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, Electrical Engineering, or a related field.
- Experience in process development or packaging R&D, with a strong track record in advanced packaging technologies is an added advantage.