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Micron Technology

Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeFull-time3 weeks ago
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About the role

AI summarised

Product Engineer role in Micron's Heterogeneous Integration Group, focusing on High Bandwidth Memory (HBM) package product engineering. Responsibilities include yield improvement, root cause analysis, and cross-functional collaboration to drive quality, cost, cycle time, and scale for next-generation HBM products.

IDMFull-timeHIG

Key Responsibilities

  • ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process.
  • HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield.
  • Root Cause and Resolution of Qual and RMA Packaging Issues: Debug and identify root cause and failures in by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
  • Backend Process Conversions and HVM: Work with FAB, Technology Development, Advanced Packaging TD, Package Development Teams to establish a robust Process Conversion Business Process to facilitate Yield Improvement, DPM Improvement and overall performance of HBM Products. Provide recommendation to PDE teams for new process conversions to reduce cost, increase yields.
  • Cross-Functional Collaboration: Work closely with various cross-functional teams, including Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams, to ensure the holistic development and successful shipping of end products.
  • Promotion of Innovation: Promote innovation and drive changes that provide a technical advantage over competitors, maintaining the company's competitive edge in the market.
  • Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
  • Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
  • AI/ML Advocate: Collaborate with cross-functional teams to develop, deploy, and validate AI/ML models aimed at enhancing key performance indicators (KPIs) such as Quality, Cost, Cycle Time, and Scale.

Requirements

  • Bachelors/Masters of Electrical/Electronic/Mechanical Engineering Degree with more than 3 years of experience in the semiconductor industry.
  • Product Engineering and Packaging Experience is preferred.
  • Demonstrating Competent Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.
  • Good knowledge of statistics and data analysis tools and scripting.
  • Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
  • Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
  • Strong sense of responsibility and accountability towards assigned role with professional work ethic.
  • Excellent communication and presentation skills.
  • Passionate about people leadership, with a drive toward ongoing learning and development in this area.
  • Work on site in Singapore with international travel to Taiwan, US, Japan.