About the role
AI summarisedThis is a research engineer role at IME (Institute of Microelectronics) focused on BEOL furnace process development and support in a cleanroom environment. The role involves developing and optimizing thermal processes for advanced interconnect technologies, photonic integration, and 3D integration, while collaborating with R&D teams.
ResearchFull-timeInstitute of Microelectronics
Key Responsibilities
- Develop and optimize BEOL thermal processes including Metal anneal, Barrier/liner stabilization, Dielectric curing, Passivation and Stress-relief anneals
- Perform tool qualification, recipe loading, chamber matching, SPC set up and contamination monitoring
- Troubleshoot process excursions and ensure stable operations with high repeatability
- Correlates anneal conditions with film quality, stress, adhesion, and reliability metrics
- Work closely with teams in Photonic IC, Wide-Bandgap Devices, Packaging and reliability for process integration
- Provide guidance for internal projects on thermal budgets, thermal-stress implications, and BEOL process compatibility for novel materials and device architectures
Requirements
- Degree (Bachelor, or Master based on job scope) or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields
- 3 years of working experience in Semiconductor Fabrication is advantageous
- Hands-on experience with furnace processing, anneals, or BEOL-related thermal steps is highly wanted
- Knowledge of metallization physics, anneal passivation, interconnect reliability and dielectric curing
- Understanding of thermal budget constraints and stress-management in BEOL stacks
- Hands-on experience in Design of Experiments (DOE), root cause analysis, and problem-solving methods is desired
- Experience in Photonic IC, SiC devices, 2.5D/3D packaging and/or Wafer Bonding would be a plus
- Proficiency with materials characterization tools, such as ellipsometry, XRD, XPS, TEM, SEM, stress measurement