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Micron Technology

ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 4 weeks ago
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About the role

AI summarised

This entry-level package development engineering role supports package-silicon integration activities under close guidance from senior engineers. The position involves assisting with chip-package interaction assessments, DFMEA/PFMEA participation, test vehicle execution, and cross-functional collaboration with wafer fab, R&D, and manufacturing teams. It is designed for early-career engineers to build foundational skills in semiconductor packaging, manufacturing processes, and structured problem-solving within a high-volume memory manufacturing environment.

IDMOnsiteAssembly & Test

Key Responsibilities

  • Support chip‑package interaction (CPI) assessments by collecting data, performing basic analysis, and documenting results under guidance from senior engineers
  • Assist package design, scribe design, and assembly engineers in investigating wafer dicing, singulation, and integration topics
  • Participate in DFMEA / PFMEA activities by helping prepare inputs, reviewing risk items, and tracking action items
  • Work with wafer fab, R&D, and manufacturing teams to support yield, quality, and manufacturability issue investigations
  • Support execution of test vehicles and DOEs, including data collection, basic analysis, and report preparation
  • Learn Micron’s package and silicon development flows, design rules, and change‑management processes
  • Escalate technical issues and risks promptly and seek guidance when encountering unfamiliar problems

Requirements

  • Bachelor’s or Master’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical, or related discipline)
  • Less than 2 years of relevant experience, including internships, co‑op programs, or research experience in semiconductor, materials, or manufacturing fields
  • Fundamental understanding of semiconductor manufacturing and/or packaging concepts (coursework or internship level)
  • Exposure to structured problem‑solving methods (FMEA, DOE, data analysis) through academics or internships
  • Ability to follow defined engineering procedures, analyze straightforward technical problems, and learn from feedback
  • Strong attention to detail and willingness to learn new tools, processes, and technologies
  • Basic proficiency in Microsoft Excel, Word, and PowerPoint for data analysis and documentation
  • Good written and verbal communication skills, with the ability to collaborate effectively in a team environment