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Applied Materials

Technical Director, Advanced Packaging Integration

Applied Materials
Equipment EngineeringSingapore,SGPOnsitePosted 2 weeks ago
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About the role

AI summarised

Join the Disruptive Technology Pathfinding team within Applied Materials’ Advanced Packaging division as a Technical Director. This role focuses on advanced packaging process integration, leading complex technology and engineering development projects with an emphasis on materials and process development for large form factor substrates.

EquipmentOnsiteEngineering

Key Responsibilities

  • Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies.
  • Define, document, and implement end-to-end process flows for panel-level packaging technologies.
  • Lead material selection, characterization, and compatibility assessments for large form factor substrates.
  • Partner with customers to define and align process specifications and acceptance criteria.
  • Collaborate on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers.
  • Contribute to Applied’s equipment product strategy by providing feedback on process and hardware enhancements.
  • Analyze process data to identify trends, drive optimization, and improve performance.
  • Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability.
  • Design and execute complex engineering experiments, collect data, and deliver rigorous reports with innovative solutions.
  • Publish and present technical findings at leading industry conferences and in peer-reviewed journals.

Requirements

  • Master’s degree with 10 years of experience OR PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field.
  • In-depth knowledge of advanced 2.xD packaging technologies (e.g., FOPLP, interposer, substrate/wafer-level back-end technologies).
  • Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition, and materials modification.
  • Strong understanding of process equipment and packaging specific materials, including selection criteria and performance trade-offs.
  • Proficiency in statistical data analysis (e.g., DoE, JMP).
  • Solid understanding of process characterization, metrology, materials & failure analysis.
  • Proven capability to lead multi-functional teams in resolving complex technical problems.
  • Exceptional written and verbal communication skills, including developing executive-level presentations.