Micron Technology

Dry Etch Staff/Principal Engineer - Advanced NAND

Micron Technology
Integrated Device ManufacturingSingapore, SingaporeOnsitePosted 3 months ago

About the role

AI summarised

As a Staff/Principal Engineer in Advanced NAND Dry Etch R&D, you will lead the development of critical dry etch modules for next-generation NAND technologies, collaborate across process integration teams, mentor peers, and drive process roadmaps to meet yield and program goals. You will work with state-of-the-art dry etch chambers and contribute to innovation in high aspect ratio etching, staircase structures, and tier-by-tier etching.

IDMOnsiteSTPG

Key Responsibilities

  • Leading Dry Etch unit process and critical module development
  • Develop/innovate dry etch processes to meet structural and electrical specifications
  • Collaborate and lead cross functional teams to solve complex structural problems
  • Present process and technology roadmaps for current and future technology nodes
  • Associated with critical modules such as HAR, Tier by tier etches, WL contacts & staircase
  • Identify opportunities & drive towards a collaborative solution
  • Lead or be a part of cross functional task force groups driving towards a target
  • Be a resource and mentor for peers in dry etch technology and/or project management
  • Provide critical updates to upper management on project status and impacts

Requirements

  • Demonstrated aptitude for a research and development environment
  • 3-10 years’ experience in dry etch process development in R&D transferring to manufacturing
  • 2-3 years of relevant NAND, DRAM or Logic module development experience
  • Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework
  • Demonstrated leadership in problem solving. Experience in managing technical projects
  • Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries)
  • Expertise in statistical process control and analysis
  • Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes
  • Demonstrated ability to lead supplier head to heads
  • Data science basics / Python coding / AI coders shall be preferred over candidates without this experience
  • Strong computer skills, including MS Office, and SAS software like JmP and similar
  • Masters / PhD (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with 4-10 years of relevant dry etch process development experience
  • Bachelors (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with 7-12 years of relevant experience